Products

Electronics-Related Products

Semiconductor-Related Materials

Cleaning Sheet for Encapsulation Molding Die

• N-CS Series

CMP Slurry <HS Series>

• BEOL Application
• FEOL Application

Die Bonding Paste

• for Lead Frame
• for Substrate

Die Bonding Film

• Dicing Die Bonding Film
• Underfill film

Epoxy Molding Compounds

• for Lead Frame
• for Power Devices
• for Substrate

Liquid Encapsulants

• CEL-C Series

Liquid Polyimides

• HD MicroSystems, LLC.

High Heat Resistant Coating Materials

• for Screen Printing
• HL Series

MAP Molding Support Tape

• RT Series

Photosensitive Insulation Coating

• AH Series

Release Sheet

• RM Series

Display & Optics-Related Materials

Anisotropic Conductive Film

• for COG
• for Solderless Connective Film
• for TAB

Transparent Conductive Transfer Film

• MS series

Base Materials for PWBs

• Glass Epoxy Multilayer Material (FR-4)
• Halogen Free Multilayer Material
• High Heat Resistance Multilayer Material
• (FR-4)
• High Tg Glass Epoxy Multilayer Material
• High Elastic Modulus, Low CTE Glass
• Epoxy Multilayer Material
• Halogen Free, High Elastic Modulus,
• Low CTE Multilayer Material
• High Elastic Modulus, Low CTE Multilayer
• Materials for Thin Package Substrates
• <MCL>
• Low Dissipation Factor, High Heat
• Resistance Multilayer Material
• Low Transmission Loss Material
• Low Dielectric Constant, Low Dissipation
• Factor, High Heat Resistance Multilayer
• Material <MCL>
• Halogen Free, Low Dielectronic Constant,
• High Heat Resistance Multilayer Material
• <MCL>
• Halogen Free, Low Dielectronic Constant,
• Low Dissipation Factor Multilayer Material
• <MCL>
• Glass Epoxy Copper Clad Laminate (FR-4)
• Low Press Temperature, Adhesive Film
• (AS-2600)

Printed Wiring Boards

• Package Substrate
• <High Density Build-up Multilayer Board>
• Package Substrate <Cavity BGA>
• High Layer and Large Size PWB
• High Density Build-up Multilayer Board
• High Density Multi-Wire Board
• PWB for IC Testers
• Test Fixture System for Logic IC