Showa Denko Materials (America) Inc.

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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material

MCL-E-679F(R) ・ GEA-679F(R) <prepreg>

"Type No. MCL-E-679F is high elastic modulus and low CTE materials. (20% lower of CTE compared to conventional FR-4.) And it has the properties for higher elasticity, higher barcol hardness.

The warpage is very low, and it is suitable for the substrates of plastic BGA, memory card, memory module boards, base core material for build-up PWB, and LCD's driver boards."

Features

  • The coefficient of thermal expansion is about 20% (in the X and Y-directions) and about 50% (in the Z-direction) lower than that of our standard FR-4.
  • Elastic modulus is about 30% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
  • Superior heat resistance at PCT.
  • The surface roughness is about 1/4 that of our standard FR-4, making fine pattern possible.

Applications

  • Semiconductor packages. (FC-BGA, BGA, CSP)
  • Core material for HDI.

Characteristics

Thin Laminate

Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)
MCL-E-679F(R)
 Dielectric Constant 1MHz C-96/20/65 -- 4.8 ~ 5.0 2.5.5.1
 Dissipation Factor 1MHz C-96/20/65 -- 0.0080 ~ 0.100 2.5.5.1
 Tg TMA °C 160 ~ 170 2.4.24
 Flexural Modulus  (Lengthwise) A GPa 27 ~ 33 2.4.4
 CTE*1 X (30～120°C) ppm/°C 12 ~ 14 2.4.24
Y 12 ~ 14
Z (<Tg) 20 ~ 30
(>Tg) 130 ~ 160
 Copper Peel Strength 18μm A kN/m 1.1 ~ 1.2 2.4.8
 Water Absorption   E-24/50+D-24/23 % 0.03 ~ 0.05 2.6.2.1

*1): Heating Rate: 10°C/min.

Prepreg

Type Glass Cloth Properties
Style Weight
(g/m 2) 		Yarn Count (warpxfill) Resin Content
(%) 		Volatile Content
(%) 		Gelation Time (sec.) Dielectric Thickness after Lamination *1 (mm)
 R  Type  0.04 FRZPE
1037
 24 69x72 73±2 <0.1 115±25 0.048
 0.06 FREOE
1078
 48 53x53 68±2 110±25 0.078
 0.1 FRSKE
2116
 104 60x58 58±2 <0.75 0.125

*1) : The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 5%. This value changes according to the press condition and inner-layer pattern.