MCL-E-679F(R) ・ GEA-679F(R) <prepreg>
"Type No. MCL-E-679F is high elastic modulus and low CTE materials. (20% lower of CTE compared to conventional FR-4.) And it has the properties for higher elasticity, higher barcol hardness.
The warpage is very low, and it is suitable for the substrates of plastic BGA, memory card, memory module boards, base core material for build-up PWB, and LCD's driver boards."
Items | Conditions | Units | Actual Values (t0.8mm) | Test Method (IPC TM-650) | |
---|---|---|---|---|---|
MCL-E-679F(R) | |||||
Dielectric Constant | 1MHz | C-96/20/65 | -- | 4.8 ~ 5.0 | 2.5.5.1 |
Dissipation Factor | 1MHz | C-96/20/65 | -- | 0.0080 ~ 0.100 | 2.5.5.1 |
Tg | TMA | °C | 160 ~ 170 | 2.4.24 | |
Flexural Modulus (Lengthwise) | A | GPa | 27 ~ 33 | 2.4.4 | |
CTE*1 | X | (30~120°C) | ppm/°C | 12 ~ 14 | 2.4.24 |
Y | 12 ~ 14 | ||||
Z | (<Tg) | 20 ~ 30 | |||
(>Tg) | 130 ~ 160 | ||||
Copper Peel Strength | 18μm | A | kN/m | 1.1 ~ 1.2 | 2.4.8 |
Water Absorption | E-24/50+D-24/23 | % | 0.03 ~ 0.05 | 2.6.2.1 |
*1): Heating Rate: 10°C/min.
Type | Glass Cloth | Properties | |||||||
---|---|---|---|---|---|---|---|---|---|
Style | Weight (g/m 2) |
Yarn Count (warpxfill) | Resin Content (%) |
Volatile Content (%) |
Gelation Time (sec.) | Dielectric Thickness after Lamination *1 (mm) | |||
R Type | 0.04 | FRZPE | 1037 |
24 | 69x72 | 73±2 | <0.1 | 115±25 | 0.048 |
0.06 | FREOE | 1078 |
48 | 53x53 | 68±2 | 110±25 | 0.078 | ||
0.1 | FRSKE | 2116 |
104 | 60x58 | 58±2 | <0.75 | 0.125 |
*1) : The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 5%. This value changes according to the press condition and inner-layer pattern.