MCL-E-73 ・GEA-73N <prepreg>
MCL-E-73 has superior heat resistance property, which is suitable for the lead free soldering process with lower CTE and excellent through-hole reliability. It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc...
Items | Conditions | Units | Actual Values (t0.8mm) | Test Method (IPC TM-650) | |
---|---|---|---|---|---|
Tg | TMA | °C | 135 ~ 145 | 2.4.24 | |
CTE*1 | X | (30~120°C) | ppm/°C | 12 ~ 15 | 2.4.24 |
Y | 14 ~ 17 | ||||
Z | (<Tg) | 35 ~ 45 | |||
(>Tg) | 180 ~ 240 | ||||
Copper Peel Strength | 18μm | A | kN/m | 1.2 ~ 1.4 | 2.4.8 |
Water Absorption | E-24/50+D-24/23 | % | 0.04 ~ 0.06 | 2.6.2.1 | |
CAF | 85°C/85%RH,100V | Hrs. | >1000 | -- | |
Decomposition Temperature (5%Weight Loss) | TGA | °C | 340 ~ 360 | 2.3.40 |
*1) : Heating Rate:10°C/min.