Showa Denko Materials (America) Inc.

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High Heat Resistance Multilayer Material (FR-4)

MCL-E-73 ・GEA-73N <prepreg>

MCL-E-73 has superior heat resistance property, which is suitable for the lead free soldering process with lower CTE and excellent through-hole reliability. It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc...


  • Heat resistance is superior to that of our standard FR-4, and suitable for the lead free process.
  • The coefficient of thermal expansion is lower than that of our standard FR-4 and that makes excellent through-hole reliability.
  • Suitable for punching process.
  • CAF restraining property is superior to that of our standard FR-4.


Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)
 Tg TMA °C 135 ~ 145 2.4.24
 CTE*1 X (30~120°C) ppm/°C 12 ~ 15 2.4.24
Y 14 ~ 17
Z (<Tg) 35 ~ 45
(>Tg) 180 ~ 240
 Copper Peel  Strength 18μm A kN/m 1.2 ~ 1.4 2.4.8
 Water Absorption E-24/50+D-24/23 % 0.04 ~ 0.06
 CAF 85°C/85%RH,100V Hrs. >1000 --
 Decomposition Temperature  (5%Weight Loss) TGA °C 340 ~ 360 2.3.40

*1) : Heating Rate:10°C/min.