Hitachi Chemical Co. America, Ltd.

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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL>

MCL-HE-679G ・GHA-679G <prepreg>

MCL-HE-679G is halogen free and has good dielectric characteristic suitable for high frequency signals, and superior heat resistance for high layer count board. lt is suitable for network applications (router, server), and high frequency devices.

Features

  • Dissipation factor is about 50% lower than that of our standard FR-4.
  • High Tg and superior heat resistance for soldering. (Suitable for the lead free process)
  • The coefficient of thermal expansion in Z-direction is about 30% lower than that of our standard FR-4.
  • Environmentally friendly material. It achieved the UL 94-V-O level of flammability without using any compound which includes halogen, antimony or red phosphorous.

Characteristics

Thin Laminate

Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)

 Dielectric  Constant

 1MHz C-96/20/65 -- 4.30 ~ 4.50 2.5.5.1
1Ghz*1 3.90 ~ 4.10 2.5.5.5
1Ghz*2 4.10 ~ 4.30 2.5.5.9
 Dissipation  Factor 1MHz C-96/20/65 -- 0.0060 ~ 0.0080 2.5.5.1
1Ghz*1 0.0080 ~ 0.0100 2.5.5.5
1Ghz*2 0.0070 ~ 0.0090 2.5.5.9
 Copper Peel  Strength 18μm A kN/m 0.8 ~ 1.1 2.4.8
 Tg TMA °C 180 ~ 190 2.4.24
 Solder Heat Resistance  (260°C) A Sec. > 300 --
 Water Absorption E-24/50+D-24/23 % 0.03 ~ 0.04 2.6.2.1
 CAF 85°C/85% RH, 100V Hrs. > 1000 --
 Flammability (UL-94) A -- V-0 Equivalent 2.3.10
 Decomposition  Temperature(5% Weight  Loss) TGA °C 370 ~ 390 2.3.40

*1) : Measured by Triplate-line Resonator.
*2) : Measured by Material Analyzer.

 

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