for COG

This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.

Features

Microscopic bump applicable
High adhesion and high reliability
Low contact resistance
Short bonding time
For low stress

Principle of connection

Applications

- Interconnection between LCD and driver IC

Characteristics (Typical Values)

Item		Unit	AC-8000 series
Application		-	for COG
Fine pitch capability	Min. contact area	μm ²	1000
Fine pitch capability	Min. space	μm	10
Bonding condition	Temp.	°C	170~
	Time	sec	5~
	Pressure	PMa	50~150*

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