This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.
- Interconnection between LCD and driver IC
Item | Unit | AC-8000 series | |
---|---|---|---|
Application | - | for COG | |
Fine pitch capability | Min. contact area | μm 2 | 1000 |
Min. space | μm | 10 | |
Bonding condition | Temp. | °C | 170~ |
Time | sec | 5~ | |
Pressure | PMa | 50~150* |