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Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.
This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.
"CEL" with high thermal conductivity and superior moldability is suitable for power devices. The power devices get higher thermal conductivity by combining "CEL" with our high thermal conductive die bonding paste.