Electronics-Related Products

Semiconductor-Related Materials

Cleaning Sheet for Encapsulation Molding Die

• N-CS Series

CMP Slurry <HS Series>

• FEOL Application
• BEOL Application

Die Bonding Paste

• for Lead Frame
• for Substrate

Die Bonding Film

• Dicing Die Bonding Film
• Underfill film

Epoxy Molding Compounds

• for Lead Frame
• for Substrate
• for Power Devices

Liquid Encapsulants

• CEL-C Series

Liquid Polyimides

• HD MicroSystems, LLC.

High Heat Resistant Coating Materials

• HL Series
• for Screen Printing

MAP Molding Support Tape

• RT Series

Photosensitive Insulation Coating

• AH Series

Release Sheet

• RM Series

Display & Optics-Related Materials

Anisotropic Conductive Film

• for TAB
• for COG
• for Solderless Connective Film