HAE Series
Dicing film is an adhesive tape to hold and protect semiconductor wafers from the dicing process to the pickup process. Especially this stretchable film improves the efficiency in the pickup process. Various grades are available to suit the cutting method and the chip size.
RM Series
Release sheet reduces the flash burr in molding of QFN packages etc.
Item | Unit | HAE-1525 | HAE-1503L | HAE-1503 | HAE-1503H | HAE-1504 | HAE-1505 | HAE-1506 | |
---|---|---|---|---|---|---|---|---|---|
Standard adhesion | gf/25mn | 35 | 40 | 50 | 58 | 80 | 130 | 250 | |
Dimension | Thickness | μm | 80 | ||||||
Width | mm | 150 | |||||||
Length | m | 100 | |||||||
Hue of film | - | ||||||||
Material of film | - | PVC | |||||||
Material of separator | - | PAPER | |||||||
Properties of machine | Tensile strength | kgf/cm2 | 260 | ||||||
Elongation | % | 260 | |||||||
Elastic modulus | kgf/mm2 | 5.4 | |||||||
50% modulus | kgf/cm | 0.7 | |||||||
Size of chips | - | large<>small |
Note : Standard adhesion means an adhesion to the adherend for which SUS430-BA plate used,and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.
Item | Unit | HAE-1625 | HAE-1603L | HAE-1603 | HAE-1603H | HAE-1604 | HAE-1605 | HAE-1606 | |
---|---|---|---|---|---|---|---|---|---|
Standard adhesion | gf/25mn | 35 | 40 | 50 | 58 | 80 | 130 | 250 | |
Dimension | Thickness | μm | 80 | ||||||
Width | mm | 150 | |||||||
Length | m | 100 | |||||||
Hue of film | - | ||||||||
Material of film | - | PVC | |||||||
Material of separator | - | OPP film | |||||||
Properties of machine | Tensile strength | kgf/cm2 | 260 | ||||||
Elongation | % | 260 | |||||||
Elastic modulus | kgf/mm2 | 5.4 | |||||||
50% modulus | kgf/cm | 0.7 | |||||||
Size of chips | - | large<>small |
Note : Standard adhesion means an adhesion to the adherend for which SUS430-BA plate used,and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.
Item | Unit | RM-4100 |
---|---|---|
Structure | - | Release layer Base Film |
Thickness | mm | 0.04 |
Tensile strength | PMa | 40 |
Tensile elongation | % | 50 |
Width | mm | 50~300 |
Length | m | 100 |
Product | - | Roll (Diameter: Approx. 12cm) |
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Loading RM-4100 and lead frame with chips on mold machine |
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Transferring mold resin into cavities after closing and clamping the molds tightly. |
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Opening the molds and removing the molded lead frame. |
* The above datasheet is a sample observation value under certain testing conditions, not guaranteed performance.