A multilayer board suitable for applications requiring higher density and increase in number of layers. This board is also applicable to large-size products.
Features
Realize superior plating process of the through-holes with a high aspect ratio, by usingour own electroless copper plating technology.
Capable of producing large-sized products (1150×470 (mm) for 4-layer, 790×610 (mm) for 6-layer or more)
