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By utilizing proprietary technologies of ultra fine line wiring and electroless gold plating, we can make high density PWBs. Also, we can contribute to the thin layer formation with varieties of material selection.
We can provide the best combinations with various materials to meet the customer needs, and also realize multi-tier structure.
A multilayer board suitable for applications requiring higher density and increase in number of layers. This board is also applicable to large-size products.
High Density Interconnection(HDI) Multilayer Board is using materials and processes developed on our own. As a product attaining both higher density and higher reliability, it is able to realize downsizing, weight reduction and functional improvement of electronic equipment.
Multiwire Board, is a PWB where copper wire pre-insulated with a polyimide resin is embedded in the insulation layer by a wiring machine to form a circuit.
Multiwire Board allows cross wiring so that the number of wires containable in one layer significantly increases, and consequently an high-density board can be manufactured with a smaller number of layers than an ordinary PWBs. In addition, as Multiwire Board uses copper wire of a uniform diameter, it is superior in various electr characteristic impedance. Multiwire Board has characteristics of equal length wiring between high speed CPUs. Comparing with the PWBs using etching method, easy pattern designing can be achieved with MWB.
The probe card makes it possible to use Multi-wire technology, improve the timing accuracy and low-crosstalk design by high precision, equal length wiring of characterictic impedance.
This is a mass-produced IC test fixture and eliminated the need for manual wiring.