UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.
Item | Unit | FC-212K | UF-536 | Test method | |
---|---|---|---|---|---|
Conductive particles | -- | Included | None | -- | |
Die bonding condition | Temp. | °C | 180 | 180 | -- |
Load | MPa | 1 | 1 | -- | |
Time | s | 20 | 20 | -- | |
Elastic modulus (40) | GPa | 6.6 | 6.6 | DMA | |
Tg | °C | 172 | 172 | DMA |