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UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.
| Item | Unit | FC-212K | UF-536 | Test method | |
|---|---|---|---|---|---|
| Conductive particles | -- | Included | None | -- | |
| Die bonding condition | Temp. | °C | 180 | 180 | -- |
| Load | MPa | 1 | 1 | -- | |
| Time | s | 20 | 20 | -- | |
| Elastic modulus (40) | GPa | 6.6 | 6.6 | DMA | |
| Tg | °C | 172 | 172 | DMA | |