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HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. This film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.
| Item | Unit | HL-1200 | HL-1450 | |
|---|---|---|---|---|
| Features | -- | High heat reisitance | Low modulus | |
| Liquid properties |
Solid content | % | 12 | 4.8 |
| Viscosity | Pa?s | 0.5 | 1.1 | |
| Resin properties |
Tg | °C | 225 | 180 |
| Decomposition temp. | °C | 400 | 390 | |
| CTE | ppm/°C | 50 | 100 | |
| Elastic modulus | MPa | 2,600 | 680 | |