RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.
Item | Unit | RT-321 | RT-521 |
---|---|---|---|
Features | -- | Standard | Cu L/F |
Bonding temp. | °C | 200~250 | 200~250 |
Detaping temp.* | °C | 25~200 | 25 |
Flash burr after molding | -- | None | None |
Residue after detaping | -- | None | None |